Printed Circuit Boards (PCB) Workforce Development Program
Agency: U.S. Mission to Mexico
- 19.750 -- Bureau of Western Hemisphere Affairs (WHA) Grant Programs (including Energy and Climate Partnership for the Americas)
Closed opportunityLast Updated: May 13, 2026
View version history on Grants.gov
Description
U.S. Embassy Mexico City of the U.S. Department of State announces an open competition for organizations to submit applications to carry out a program to promote workforce development in the printed circuit board (PCB) industry through curriculum development for PCB focused courses at secondary and tertiary educational levels, certificate programs, vocational instruction, dual education, technical English language skills building, and full or partial support for internships in Taiwanese PCB manufacturing firms either in Taiwan or Mexico.
Eligibility
Eligible applicants
Miscellaneous
- Other
Additional information
Grantor contact information
Description
For Inquiries
Documents
| File name | Description | Last updated |
|---|---|---|
| NOFO_-_USMEXTWN_PCB_Manufacturing_Partnership_1.pdf | NOFO PCB workforce development_1 | Jul 19, 2024 02:40 PM UTC |
Link to additional information
Closed: August 2, 2024
Award
$250,000
Program Funding
1
Expected awards
$250,000
Award Minimum
$250,000
Award Maximum
Funding opportunity number:
OFOP0001480
Cost sharing or matching requirement:
Funding instrument type:
Grant
Opportunity Category:
Discretionary
Opportunity Category Explanation:
Category of Funding Activity:
Other
Category Explanation:
Economic Development
History
Version:
2
Posted date:
June 26, 2024
Archive date:
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