National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D)
Agency: National Institute of Standards and Technology
- 11.042 -- CHIPS Research and Development
Last Updated: May 13, 2026
Important dates
- Closing: Not specified
Award details
- Expected project funding: Not specified
- Expected awards: Not specified
Award min.
Not specified
Award max.
Not specified
- Funding opportunity number:2025-NIST-CHIPS-NAPMP-01
- Cost sharing or matching requirement:No
- Funding instrument type:Not specified
- Opportunity Category:Discretionary
- Opportunity Category Explanation:Not specified
- Category of Funding Activity:Not specified
- Category Explanation:Not specified
History
- Posted date: Not specified
- Archive date: Not specified
- Version: Not specified
Summary
Jump to documentsEligibility
Additional information on eligibility
Documents
| File name | Description | Last updated |
|---|---|---|
| CHIPS_NAPMP_NOFO_2_for_publish.pdf | 2025-NIST-CHIPS-NAPMP-01 NOFO | Oct 18, 2024 06:02 PM UTC |
Agency contact information
Email: Not specified
No additional contact information provided.
Link to additional information
No additional information is available
