FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates

Agency: National Institute of Standards and Technology

11.042 -- CHIPS Research and Development

Archived opportunityLast Updated: May 13, 2026

Description

The CHIPS Research and Development Program (CHIPS R&D) aims to advance the development of semiconductor technologies and to enhance the competitiveness of the U.S. semiconductor industry. This is the first Notice of Funding Opportunity under this program. It seeks applications for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for producing microelectronics systems.

Eligibility

Eligible applicants

Miscellaneous

Other

Additional information

Eligible applicants include domestic for-profit and non-profit organizations; accredited domestic institutions of higher education including community and technical colleges; and state, local, territorial, and Indian tribal governments. Eligible applicants may only submit one full application under this NOFO. Entities may not be included as subrecipients on more than two applications.

Grantor contact information

Description

Misty L Roosa Management Analyst

Email

Agency Contact

grants@nist.gov

Documents

File name	Description	Last updated
CHIPS_NAPMP_MATERIALS_AND_SUBSTRATES_NOFO.pdf	2024-NIST-CHIPS-NAPMP-01 NOFO	Feb 27, 2024 09:05 PM UTC

Link to additional information

Archived: August 2, 2024

Application process

This site is a work in progress. Go to www.grants.gov to apply, track application status, and subscribe to updates.

Award

$--

Program Funding

Expected awards

$--

Award Minimum

$--

Award Maximum

Funding opportunity number:

2024-NIST-CHIPS-NAPMP-01

Cost sharing or matching requirement:

Funding instrument type:

Other

Opportunity Category:

Discretionary

Opportunity Category Explanation:

Category of Funding Activity:

Science technology and other research and development

Category Explanation:

History

Version:

Posted date:

February 28, 2024

Archive date:

August 2, 2024