DE-FOA-0003426: RFI Microelectronics Energy Efficiency Scaling for 2 Decades (EES2) R&D Roadmap — Public Feedback

each focusing on specific layers of the computing stack or on enabling technologies and approaches. Working group deliberations focused on identifying key emerging, energy-efficient technologies and their challenges and solutions. The EES2 working groups for version 1.0 are: a. Materials and Devices (MnD) b. Circuits and Architectures (CnA) c. Advanced Packaging and Heterogenous Integration (APHI) d. Algorithms and Software (AnS) e. Power and Control Electronics (PaCE) f. Manufacturing Energy Efficiency and Sustainability (MEES) g. Metrology and Benchmarking (MnB) h. Education and Workforce Development (EWD) Responses to this RFI must be submitted electronically to micro.electronics@ee.doe.gov no later than 5:00pm (EDT) on September 30, 2024. Responses must be provided as a Microsoft Word (.docx) attachment to an email. It is recommended that attachments with file sizes exceeding 25MB be compressed (i.e., zipped) to ensure message delivery. This RFI is not accepting applications for financial assistance or financial incentives. EERE may or may not issue a Funding Opportunity Announcement (FOA) based on consideration of the input received from this RFI. Please see the full RFI document for additional information.